发明名称 Polyester resin and resin composition for molding, and formed product thereof
摘要 In a saturated polyester resin or a composition with the saturated polyester resin as the main component for molding, the melt viscosity at 200° C. is at least 5 dPa.s and not more than 1000 dPa.s, and the product axb is at least 500 where a (N/cm<SUP>2</SUP>) is the tensile breaking strength and b (%) is the tensile breaking elongation of a film shape formed product. Preferably, the polyester resin has a glass transition temperature of not more than -10° C., a melting point of at least 70° C. and not more than 200° C., and an ester group concentration of at least 1000 equivalents/10<SUP>6 </SUP>g and not more than 8000 equivalents/10<SUP>6 </SUP>g. A material superior in water resistance, electrical insulation, durability, working environment and productivity as a molding material for an electric electronic component having a sophisticated configuration is provided.
申请公布号 US7381358(B2) 申请公布日期 2008.06.03
申请号 US20040863342 申请日期 2004.06.09
申请人 TOYO BOSEKI KABUSHIKI KAISHA 发明人 NISHIDA MITSUO;IRITANI OSAMU
分类号 B29C45/14;C08G63/16;C08G63/183;C08G63/189;C08G63/672 主分类号 B29C45/14
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