发明名称 Epoxy group-containing silicon compound and thermosetting resin composition
摘要 The present invention relates to an epoxy group-containing silicon compound which is obtained by condensing at least one epoxy group-containing alkoxy silicon compound per se represented by the general formula (1a): R<SUB>1a</SUB>Si(OR<SUB>2</SUB>)<SUB>3</SUB>, wherein R<SUB>1a </SUB>denotes a substituent having an epoxy group and R<SUB>2 </SUB>denotes an alkyl group having at most 4 carbons, or said compound and at least one substituted alkoxy silicon compound represented by the general formula (1b): R<SUB>1b</SUB>Si(OR<SUB>3</SUB>)<SUB>3</SUB>, wherein R<SUB>1b </SUB>denotes an alkyl group having at most 10 carbons, an aryl group or an unsaturated aliphatic residue and R<SUB>3 </SUB>denotes an alkyl group having at most 4 carbons, in the presence of a basic catalyst.
申请公布号 US7381784(B2) 申请公布日期 2008.06.03
申请号 US20050542718 申请日期 2005.07.20
申请人 NIPPON KAYAKU KABUSHIKI KAISHA 发明人 NAKAYAMA KOJI
分类号 C08G77/08;C08G77/14;C08L63/00;C08L83/06 主分类号 C08G77/08
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