发明名称 Method for fabricating a semiconductor memory device that includes silicidizing a portion of a platinum group layer to form a silicide region and selectively removing the silicide region to define a bottom electrode of a capacitor
摘要 The semiconductor memory device comprises a glue layer defining a cylinder shell, a bottom electrode made of a material of the platinum group and covering the inner face and the outer face of the cylinder shell, a dielectric layer formed over the bottom electrode, and a top electrode positioned over the dielectric layer. The bottom electrode, the dielectric layer, and the top electrode comprise a cell capacitor.
申请公布号 US7381614(B2) 申请公布日期 2008.06.03
申请号 US20050041224 申请日期 2005.01.25
申请人 FUJITSU LIMITED 发明人 NISHIKAWA NOBUYUKI
分类号 H01L21/8239;H01L21/8242;H01L21/02;H01L21/8246;H01L27/105;H01L27/108 主分类号 H01L21/8239
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