| 摘要 |
A method of fabricating an inkjet printhead with a wafer substrate that has an ink ejection side and an opposing ink inlet side. The printhead has an array of nozzles formed on the ink ejection side, and an array of ink inlets formed in the ink inlet side. Each nozzle is individually associated with a respective ink inlet. The method comprises the steps of forming the array of nozzles using lithographically masked etching and deposition techniques, and, etching individual feed paths through the wafer substrate between each of the nozzles and its associated ink inlet. Feeding the ink to the nozzles by individual feed paths through the wafer, increases the nozzle packing density and the resolution.
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