| 摘要 |
<p>A pattern forming method and a circuit board are provided to shorten the time for forming a pattern by heating a substrate at a predetermined surface temperature. A pattern forming method includes a process for discharging droplets of a functional fluid including a functional material towards a substrate and forming a pattern on a surface of the substrate. The pattern forming method further includes a first process for heating a surface of the substrate at the surface temperature. The surface temperature is equal to or more than the temperature of the functional fluid in a discharging state and is less than a boiling point of a liquid composition included in the functional fluid. The pattern forming process further includes a second process for discharging the droplets of the functional fluid onto the substrate and forming a pattern while the substrate is heated at the surface temperature.</p> |
