| 摘要 |
The invention relates to a heat exchange device including at least one heat exchange wall ( 6 ) between the refrigerant fluid ( 3 ) and the fluid to be cooled ( 4 ) having on one side a so-called hot surface ( 7 ) in contact with the fluid to be cooled, and at least one mechanical system ( 10 ) antagonist to the deposition on the hot surface of the exchange wall, of a solid layer of the fluid to be cooled. According to the invention, the means antagonist to the deposition is formed with a friction means ( 11 ) including a planar surface extending parallel to the hot surface of the exchange wall and having a heat conductivity such that the ratio of the heat conductivities of said friction means on the hot surface is larger than or equal to 3, and the mechanical system ( 10 ) includes means for supporting the friction means, adapted so that the latter rubs on the hot surface of the exchange wall via its planar surface.
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