发明名称 Manufacturing method of a device
摘要 In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered to the part of the substrate, the protective material is easily peeled away. As a result, the time required for peeling can be decreased, and cracking of the device which may occur in peeling can be prevented.
申请公布号 US7381285(B2) 申请公布日期 2008.06.03
申请号 US20050105576 申请日期 2005.04.14
申请人 NEC CORPORATION;NAGASE & CO., LTD.;SANWA FROST INDUSTRY CO., LTD. 发明人 KANOH HIROSHI;TAKECHI KAZUSHIGE;UESAKA NARUMOTO;NIKAMI KAZUO
分类号 B32B37/14;H01L27/12;B32B37/06;B32B37/10;B32B38/10;G02F1/136;H01L21/02;H01L21/304;H01L21/76;H01L21/77;H01L29/786 主分类号 B32B37/14
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