发明名称 |
Manufacturing method of a device |
摘要 |
In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered to the part of the substrate, the protective material is easily peeled away. As a result, the time required for peeling can be decreased, and cracking of the device which may occur in peeling can be prevented.
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申请公布号 |
US7381285(B2) |
申请公布日期 |
2008.06.03 |
申请号 |
US20050105576 |
申请日期 |
2005.04.14 |
申请人 |
NEC CORPORATION;NAGASE & CO., LTD.;SANWA FROST INDUSTRY CO., LTD. |
发明人 |
KANOH HIROSHI;TAKECHI KAZUSHIGE;UESAKA NARUMOTO;NIKAMI KAZUO |
分类号 |
B32B37/14;H01L27/12;B32B37/06;B32B37/10;B32B38/10;G02F1/136;H01L21/02;H01L21/304;H01L21/76;H01L21/77;H01L29/786 |
主分类号 |
B32B37/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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