| 摘要 |
<p>A PCB(Printed Circuit Board), a PCB assembly, an electronic device, a method for manufacturing the PCB, a method for manufacturing the PCB assembly, and a method for correcting warpage of the PCB are provided to improve mounting reliability by preventing generation of dusts due to contact of a pressing member. A PCB(10) includes a mounting surface and a rear surface(10c) opposite to the mounting surface. An electronic component is mounted on the mounting surface. The rear surface includes warpage correcting metal patterns(18) which are installed on a plurality of points thereof. The warpage correcting metal patterns are metal layers or metal films bonded by a hot melt bonding material such as a solder and are bonded to a predetermined part of a load surface of a conveyance carrier by the hot melt bonding material. The PCB becomes flat by being closely adhered to the flat load surface to correct warpage of the PCB.</p> |
