发明名称 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
摘要 A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
申请公布号 US7381063(B2) 申请公布日期 2008.06.03
申请号 US20070865253 申请日期 2007.10.01
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HOUGHAM GARETH G.;BEAMAN BRIAN S.;COLGAN EVAN G.;COTEUS PAUL W.;OGGIONI STEFANO S.;VARGAS ENRIQUE
分类号 H01R12/00 主分类号 H01R12/00
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