A test unit of a semiconductor device is provided to enhance productivity by reducing an error rate generated due to a contact error in a test process. A probe card(102) includes a plurality of needles and a PCB pattern(100). The needles come in contact with an electrode pad of a wafer. The PCB pattern has a concavo-convex shape and is protruded from an upper surface of the probe card. A base unit pin of test equipment is loaded in a base unit(110). A ZIF PIN(106) is formed to connect the PCB pattern with the base unit. The ZIP PIN is formed in a vertical direction. A jar-shaped wave is extended from the vertical shape of the ZIP PIN. The base unit pin having a shape of saw-tooth is formed at both sidewalls of the base unit.
