ELECTRONIC COMPONENT, MANUFACTURING METHOD OF THE ELECTRONIC COMPONENT, ELECTRONIC COMPONENT ASSEMBLY BODY, AND ELECTRONIC DEVICE

摘要

An electronic component, a method for manufacturing the same, an electronic component assembly body, and an electronic device are provided to adjust a characteristic of light irradiated from a component mounting substrate to the outside by bending a lead at an arbitrary position. An electronic component(13A) includes a main body unit and a pair of leads(15). The main body unit is inserted into an opening unit(16) formed on a substrate(12). One ends of the pair of leads are bonded to the main body unit and the other ends thereof are bonded to a pad(14) which is formed on the substrate. The main body unit is installed on the leads so that a functional surface of the main body unit is positioned on one side of the leads which is bonded to the pad. The main body unit is an electronic element(20) having a structure in which a p type layer(22) and an n type layer(21) are bonded as a pn bonding layer(23). The electronic element is formed so that an extension direction of the pn bonding layer is perpendicular to a surface of the substrate when the electronic element is inserted into the opening unit.