发明名称 ATMOSPHERE CONTROLLED JOINING DEVICE, JOINING METHOD, AND ELECTRONIC DEVICE
摘要 This invention provides a joining device for pressure welding a pressure welding part that can realize pressure welding under low temperature and low pressure conditions by rendering the moisture content of the pressure welding part atmosphere within the device relatively smaller than the moisture content of the atmosphere outside the device. In this case, the amount of water adsorbed on each surface of a joining metal terminal and a metal terminal to be joined constituting the pressure welding part is brought to not more than 1 x 10^16 molecules/cm2.
申请公布号 KR20080049092(A) 申请公布日期 2008.06.03
申请号 KR20087007965 申请日期 2005.09.28
申请人 OHMI TADAHIRO 发明人 OHMI TADAHIRO;MORIMOTO AKIHIRO
分类号 H01L21/60;H05K3/32 主分类号 H01L21/60
代理机构 代理人
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