| 摘要 |
A semiconductor package and a manufacturing method thereof are provided to enhance connective reliability by connecting directly a connective pad of a semiconductor chip with a solder ball. A semiconductor chip(100) includes a plurality of bump pads(110) formed on one surface thereof and a plurality of connective pads(130) extended from the bump pads. The semiconductor chip is mounted on a substrate(200). The substrate includes an opening part corresponding to the connective pads in order to expose the connective pads. A molding part(300) is formed to cover an upper surface of the substrate including the semiconductor chip in order to protect the semiconductor chip from external environment. An external connection terminal is arranged on a lower surface of the substrate and is connected to the connective pads through the opening part.
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