A method for forming an isolation structure is provided to suppress the generation of a void on a sidewall of a trench in an isolation pattern forming process for burying the trench. A first trench is formed on a substrate(100). A preliminary liner is formed on a bottom surface and a sidewall of the first trench. A liner(125) is obtained from the preliminary liner by annealing the resultant having the preliminary liner. A first preliminary oxide layer is formed on a surface of the liner. An overhang is removed and a first oxide layer having a second trench is formed when the first preliminary oxide has the overhang. A second oxide is formed to bury the second trench. A planarization process for the second oxide layer is performed to expose an upper surface of the substrate and to form a second oxide layer pattern.
申请公布号
KR20080048767(A)
申请公布日期
2008.06.03
申请号
KR20060119141
申请日期
2006.11.29
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, BYUNG SUN;NA, KYU TAE;KIM, JU WAN;LEE, JUNG CHAN;LEE, SEUNG HEON;LEE, JEONG KYU