FLEXIBLE PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

A flexible package and a manufacturing method thereof are provided to lengthen a lifetime of a semiconductor chip package by preventing a defect of the semiconductor chip package caused by external stress. A flexible substrate(10) is made of a rubber material or a film material. A lead antenna(10a) is formed at the flexible substrate. A metal wire connects a semiconductor chip with the lead antenna and is formed into a spring type. The lead antenna and the semiconductor chip are encapsulated by using a material having a high tensile characteristic. An encapsulation material is composed of silicon. A manufacturing method of a flexible package includes a process for forming the lead antenna by etching the substrate, a process for attaching the semiconductor chip, a process for bonding the metal wire, and an encapsulation process.