SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to connect electrically a semiconductor chip and solder balls with each other by using a wire bonding method and forming via holes. A substrate(102) includes a plurality of contact pads(106) formed along an edge of a first surface thereof. A semiconductor chip(120) is installed on a center of a recess region of the substrate. The semiconductor chip includes a bond pad(122) formed on a surface thereof. A wire(124) is formed to be connected the bond pad with the contact pads. A sealing layer(130) is formed to cover the semiconductor chip and the substrate and includes a plurality of via holes(132). A plurality of solder balls(160) are arranged on the sealing layer and are connected to the contact pads through the via holes.