| 摘要 |
<p>Equipment for manufacturing a semiconductor device is provided to minimize influence of ammonia by charging the inside of an exposure device with a constant amount of nitrogen. Equipment for manufacturing a semiconductor device includes an exposure unit(200), a baking unit(500), a transfer unit(400), and a developing unit(300). The exposure unit irradiates light on a wafer on which photoresist is coated to form a predetermined pattern. The baking unit is provided in the exposure unit and heats the exposed wafer at a predetermined temperature. The transfer unit is provided in the exposure unit and transfers the wafer to the baking unit. The developing unit is installed adjacently to the exposure unit, and coats the photoresist on the wafer. The developing unit develops a pattern of the heated wafer. The baking unit is provided in the exposure unit to define a predetermined space.</p> |
