摘要 |
A FIRST SPRING (54) IS PROVIDED BETWEEN A SUPPORT MEMBER (51) DRIVEN IN THE Z-AXIS DIRECTION AND A HEATING BLOCK (53), AND THE FIRST SPRING (54) IMPELS THE SUPPORT MEMBER (51) AND THE HEATING BLOCK (53) IN MUTUALLY DISTANCING DIRECTIONS. MOREOVER, A SECOND SPRING (57) IS PROVIDED BETWEEN FIRST PUSHER (55) WHICH PRESSES A DIE (81) OF AN IC DEVICE (8) AND A SECOND PUSHER (56) WHICH PRESSES A SUBSTRATE (82) OF THE IC DEVICE (8), AND THIS SECOND SPRING (57) IMPELS THE FIRST PUSHER (55) AND THE SECOND PUSHER (56) IN MUTUALLY DISTANCING DIRECTIONS. BY AN ELECTRONIC COMPONENT HANDLING APPARATUS HAVING A CONFIGURATION OF THIS KIND, IT IS POSSIBLE TO ADAPT TO CHANGES IN THE TYPE OF ELECTRONIC COMPONENT, AND FURTHERMORE, SURFACE MATCHING IS IMPROVED AND AN ELECTRONIC COMPONENT CAN BE PRESSED UNIFORMLY BY MEANS OF A PRECISE LOAD.(FIG 4)
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