APPARATUS FOR ELIMINATING WAFER WARPAGE

摘要

An apparatus for correcting wafer warpage is provided to improve accuracy of a marking position by minimizing a height deviation of one surface of a marking wafer. A wafer supporting member(110) comes in contact with an edge of a rear surface of a marking wafer in order to support the wafer. A pressing member(120) is arranged at an upper part of the wafer supporting member and is installed movably between a descending position and an ascending position. The pressing member presses an edge of an upper surface of the wafer at the descending position. The pressing member is moved upwardly from the wafer at the ascending position. A driving unit(130) moves the pressing member to the ascending position. The driving unit includes a plurality of link members(133) having first contact parts to be coupled with the wafer supporting member and a plurality of driving sources for rotating each of the link members to an ascending direction of the first contact part.