| 摘要 |
A nonconductive paste composition for flip chip package, and a flip chip package using the composition are provided to improve heat resistance and humidity resistance, to increase glass transition temperature and to lower thermal expansion coefficient, thereby enhancing the reliance of package. A nonconductive paste composition comprises an epoxy resin which comprises an epoxy resin represented by the formula 1 and a solid phase epoxy resin represented by the formula 2; a curing agent represented by the formula 3 or 4 (wherein R1 to R3 are independently a C1-C4 alkyl or alkenyl group); a curing catalyst represented by the formula 5; and 50-80 wt% of the silica having an average diameter of 0.5-20 micrometers as an inorganic filler, wherein R is H or a methyl group; and n is 0-7.
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