发明名称 SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device for improving withstand voltage property between a resistance element and a semiconductor substrate. SOLUTION: This semiconductor substrate is provided with: a first element isolation film 2a formed in a semiconductor substrate 1 by a LOCOS oxidization method for isolating a first element region 1a from the other region; a second element isolation film 2b embedded in a groove formed in the semiconductor substrate 1 for isolating the second element region 1b from the other region; a first semiconductor element formed in the first element region 1a; a second semiconductor element formed in the second element region 1b; and a resistance element 4d formed on the first element isolation film 2a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008124384(A) 申请公布日期 2008.05.29
申请号 JP20060309196 申请日期 2006.11.15
申请人 SEIKO EPSON CORP 发明人 SHIN CHIHIRO
分类号 H01L21/8234;H01L21/76;H01L21/822;H01L27/04;H01L27/06 主分类号 H01L21/8234
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