发明名称 |
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for improving withstand voltage property between a resistance element and a semiconductor substrate. SOLUTION: This semiconductor substrate is provided with: a first element isolation film 2a formed in a semiconductor substrate 1 by a LOCOS oxidization method for isolating a first element region 1a from the other region; a second element isolation film 2b embedded in a groove formed in the semiconductor substrate 1 for isolating the second element region 1b from the other region; a first semiconductor element formed in the first element region 1a; a second semiconductor element formed in the second element region 1b; and a resistance element 4d formed on the first element isolation film 2a. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008124384(A) |
申请公布日期 |
2008.05.29 |
申请号 |
JP20060309196 |
申请日期 |
2006.11.15 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SHIN CHIHIRO |
分类号 |
H01L21/8234;H01L21/76;H01L21/822;H01L27/04;H01L27/06 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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