| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductor for flexible board in which the risk of occurrence of whisker from the surface of an Sn plating film or solder around the conductor is low or substantially zero, and the contact resistance does not increase even if the conductor is left, as it is, under high temperature environment, and to provide a flexible board. SOLUTION: In the conductor arranged in a flexible flat cable or a flexible printed board, an Sn or Sn alloy plating film 15 is formed on the surface of a Cu or Cu alloy conductor. The surface oxide films 16a and 16b of the plating film 15 are composed of an oxide of an element other than Sn, or a mixture of an Sn oxide and an oxide of an element other than Sn. COPYRIGHT: (C)2008,JPO&INPIT
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