| 摘要 |
PROBLEM TO BE SOLVED: To reduce a stress applied to a sensor chip due to a temperature change without a glass seat. SOLUTION: The sensor chip 20 has a pressure detecting diaphragm 20d as a thin section 20a, and a thick section 20b located around the diaphragm. The thick section 20b has a structure attached to one face of a circuit chip 21 having the same linear expansion coefficient as that of the sensor chip 20 through an adhesive member 22 having a conductive pattern. COPYRIGHT: (C)2008,JPO&INPIT
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