| 摘要 |
PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper plating composition which is formaldehyde free and is environmentally friendly, and also is stable and provides uniform copper deposits, and to provide an electroless copper plating method. SOLUTION: The electroless copper plating composition comprises: one or more sources of copper ions; one or more chelating agents chosen from hydantoin and hydantoin derivatives of 20 to 150 g/L; and pyruvaldehyde as a reducing agent of 10 to 100 g/L. Also, disclosed is an electroless copper plating method for a printed circuit board including a plurality of through-holes using the composition. COPYRIGHT: (C)2008,JPO&INPIT
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