| 摘要 |
A member for a semiconductor device of low price, capable of forming a high quality plating layer on a surface, having heat conductivity at high temperature (100° C.) of more than or equal to 180 W/m.K and toughness that will not cause breaking due to screwing, and will not cause solder breaking due to heat stress when it is bonded to other member with solder, and a production method thereof are provided. A member for a semiconductor device ( 1 ) having a coefficient of thermal expansion ranging from 6.5x10<SUP>-6</SUP>/K to 15x10<SUP>-6</SUP>/K inclusive, and heat conductivity at 100° C. of more than or equal to 180 W/m.K, has: a base material ( 11 ) formed of an aluminum-silicon carbide composite material starting from powder material in which particulate silicon carbide is dispersed in aluminum or aluminum alloy, and the content of the silicon carbide is from 30% by mass to 85% by mass inclusive; and a superficial layer ( 12 ) containing aluminum or aluminum alloy starting from a melt material bonded on top and bottom faces of the base material ( 11 ).
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