| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processor capable of carrying out a series of processes including a resist application and a development process after exposed for a processing substrate at a high throughput including the pre-process and the post-process, and to provide another processor capable of additionally reducing a foot-print as much as possible. <P>SOLUTION: Each of the processors has a cleaning unit 21 in which a predetermined process is carried out while a substrate G is being conveyed substantially in the horizontal direction, a resist processing unit 23, and a developing unit 43 and further has a plurality of thermal treatment unit sections 24, 25, 44 that have collected a plurality of thermal treatment units for conducting a thermal treatment accompanying each processing unit, wherein the cleaning unit 21 and the resist processing unit 23 are present on one side and the developing unit 43 is present on the other side with an exposure apparatus 3 being sandwiched in between. <P>COPYRIGHT: (C)2008,JPO&INPIT |
