发明名称 ELECTRONIC CIRCUIT MODULE, AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit module that can fix the leg piece of a sheet metal cover reliably, can utilize the entire bottom surface of a wiring board as the formation region of a land for external connection, and can promote miniaturization easily, and to provide a method of manufacturing the electronic circuit module. <P>SOLUTION: The electronic circuit module 1 has the wiring board 2 having a wiring pattern 20 and distributing the land 21 for external connection on a bottom surface for arrangement, an electronic component 3 mounted onto the ceiling surface of the wiring board 2, and the sheet metal cover 4 covering the electronic component 3. On the wiring board 2, there are a bottomed mounting hole 22 into which the leg piece 40 of the sheet metal cover 4 is inserted and a vertical hole 23 that communicates with the mounting hole 22 and releases air and a long hole 24. The inner wall section of the mounting hole 22 is composed of a metal film 22a to which the leg piece 40 is joined by solder, and the vertical hole 23 is exposed at a ceiling surface corner on the wiring board 2 not covered with the sheet metal cover 4. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008124071(A) 申请公布日期 2008.05.29
申请号 JP20060302988 申请日期 2006.11.08
申请人 ALPS ELECTRIC CO LTD 发明人 WATANABE HIDEKI;TANAKA NORIO
分类号 H01L23/02;H01L23/00;H05K1/02;H05K3/46;H05K9/00 主分类号 H01L23/02
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