| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic substrate hardly causing crack and having stable structure. <P>SOLUTION: The electronic substrate has electronic components 20, 21 and a conductive wiring 15 connected via wiring connection portions 20a, 21a of the electronic components 20, 21. The electronic substrate further has a resin layer 13 to which the electronic components 20, 21 are buried while protruding the wiring connection portions 20a, 21a and an insulating layer 60 provided in the resin layer 13 so as to include the wiring connection portions 20a, 21a and a bottom surface 15a of the conductive wiring 15, and formed of an insulating material having photocuring property and thermosetting property. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
