| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for dicing a substrate which can well dice the substrate into a plurality of chips, can prevent the chips from cracking and refuses of cracking from sticking on the chip and can increase the number of picking-up to reduce cost, a method for manufacturing a silicon device and a method for manufacturing a liquid jetting head. <P>SOLUTION: In the method for dicing the substrate for dicing the substrate into a plurality of the chips, the substrate is irradiated with a laser light from one side of the substrate, and recessed parts are formed on the other side of the substrate on the boundary lines of respective regions becoming the chips of the substrate. By fitting an optical focusing point of the laser light in the substrate on the boundary line of the substrate, fragile parts 132 with a specified width are formed in the substrate by leaving connecting parts on at least one surface layer of one side and the other side of the substrate, and thereafter, by applying an external force, the substrate is diced along the fragile parts 132 to prepare a plurality of chips. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
