| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which has a hollow part and a through via hole, the mechanical strength thereof being increased and the reliability thereof being improved, and to provide its manufacturing method. SOLUTION: The electronic device 1 wherein a chip 10 on which a function element 11 is formed and which has a surface electrode 12 and a back electrode 16 electrically connected by a conductor 15 in the through via hole 13, and a side wall part 26 and a cap 17 form a hollow part constituted of a cavity 18 is characterized in that the cap 17 is joined to the chip 10 so that the function element 11 and surface electrode 12 of the chip 10 are stored in the cavity 18 and the joint part of the cap 17 and chip 10 has an insulating film 19 formed on its outer peripheral surface. Consequently, the cap 17 and chip 10 are not merely joined, but united together with the insulating film 19, so that the mechanical strength of the electronic device 1 can be increased. COPYRIGHT: (C)2008,JPO&INPIT
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