| 摘要 |
PROBLEM TO BE SOLVED: To provide a magnetron sputtering source, a sputtering-coating system and a method for the treatment of a substrate by means of which the efficiency of coating process can be increased by increasing power density. SOLUTION: A magnetron sputtering source has a means for generating a coating plasma, and at least one magnet arrangement 7 for generating a magnetic field for the purpose of influencing the coating plasma such that at least one plasma channel 8 is generated above one section of the surface 4' of the target 4. The magnet arrangement 7 and the surface 4' of the target 4 are arranged such that they can be moved relative to each other and such that the plasma channel 8 is traversable above the surface 4' of the target 4. The magnetron sputtering source is adjusted such that, when the plasma channel 8 moves over the surface region of the target 4, the entire duration of exposure of the surface region to the plasma is reduced by an increase in the relative velocity v between the magnet arrangement 7 and the target 4. COPYRIGHT: (C)2008,JPO&INPIT
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