发明名称 BARREL PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a barrel plating apparatus which can form a plating film having uniform thickness on a work surface. SOLUTION: An electrode 11 of the barrel plating apparatus 10 has: a center bar 16; and a plurality of electrode bars 17, each having a contact 17a arranged at the tip, which are arranged in the middle of the center bar so as to be apart from each other. In an approximately middle of side walls 13a and 13b in both ends in the axis direction of a rotating barrel 12, caps 15 and 15 are firmly fixed. The caps 15 and 15 have an annular structure and have head parts of fixed shafts 18 and 18 inserted in their centers. Furthermore, the positions of sides 16b and 16b located near the ends in the axis direction of the center bar 16 of the electrode 11 in the rotating barrel 12 are regulated by faces 15b and 15b which face to each other of the cap 15. Thereby, the barrel plating apparatus can inhibit the deviation of a relative position between the work and the electrode (cathode) in the rotating barrel, and can form the plating film having uniform thickness on a plurality of the works. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008121100(A) 申请公布日期 2008.05.29
申请号 JP20060335107 申请日期 2006.11.14
申请人 TAIYO KAGAKU KOGYO KK 发明人 ISHIHARA SHOJI;SATO TAKESHI
分类号 C25D17/20;C25D17/16 主分类号 C25D17/20
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