发明名称 Method for manufacturing printed circuit boards
摘要 A printed circuit board. The novel printed circuit board includes a substrate, a layer of conductive material disposed on the substrate, and a solder mask layer disposed on the conductive layer, the solder mask layer including cutouts shaped as reference text and/or art. The conductive layer is etched to form traces for connecting electronic components to be mounted on the board in a desired pattern to form an electrical circuit and may include pads and lands to which the components are to be soldered. The solder mask layer is made from a material that resists wetting by solder and also includes cutouts in areas where the components are to be soldered to the conductive layer. The reference text and/or art includes readable information for assembling, testing, and/or repairing the circuit board, such as component part numbers, reference designators, pin one identifiers, component outlines, and test point identifiers.
申请公布号 US2008121413(A1) 申请公布日期 2008.05.29
申请号 US20070986849 申请日期 2007.11.26
申请人 CARDONA SERGIO E;APODACA JERRY 发明人 CARDONA SERGIO E.;APODACA JERRY
分类号 H05K1/00;H01R43/00 主分类号 H05K1/00
代理机构 代理人
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