<p>Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.</p>
申请公布号
WO2008064135(A1)
申请公布日期
2008.05.29
申请号
WO2007US85022
申请日期
2007.11.16
申请人
ALCES TECHNOLOGY, INC.;YEH, RICHARD;BLOOM, DAVID, M.