| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for preparing a sample for identifying an intermetallic compound formed on a bonding interface by using a direct X-ray diffraction. <P>SOLUTION: The X-ray diffraction sample is formed by ion-etching by intermittently and internally irradiating an Ar ion beam from a peeled plane disposed between a bonded metal thin wire and a ground pad metal and exposed by peeling the bonded metal thin wire using a physical force, and sequentially exposing a new observation plane. When the metal thin wire is peeled from the ground pad metal using the physical force, a hollow container stands on a bonding pad and includes a bonding wire already bonded, and a thermoset resin flows into the hollow container and is cured. It is preferable for the metal thin wire to be peeled by the physical force after it is protected by the resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
