发明名称 WIRING BOARD, AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board for preventing two opposite boards from being brought into contact with a pixel region in the case of transfer, and for surely transferring a peripheral circuit on the board. <P>SOLUTION: This method for manufacturing a wiring board comprises: a process for adhering a flexible board 11 where a protrusion 12 is formed in a pixel region 101 and the board 40 in which electronic elements 15 configuring a peripheral circuit are arranged so that the electronic elements 15 are faced to the periphery of the pixel region 101; and a process for separating the board 40 from the flexible board 11 while making the electronic element 15 on the flexible board 11. In the process for attaching the flexible board 11 and the board 40, the electronic element 15 is press-fit to the flexible board 11, and the protrusion 12 is brought into contact with the board 40 in the pixel region 101. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008124387(A) 申请公布日期 2008.05.29
申请号 JP20060309239 申请日期 2006.11.15
申请人 SEIKO EPSON CORP 发明人 HARA HISAKI
分类号 H05K3/20;G09F9/00;H01L21/02;H01L21/336;H01L21/60;H01L27/12;H01L29/786;H05K3/32 主分类号 H05K3/20
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