发明名称 METHOD FOR PRODUCING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE AND GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for producing a group III nitride semiconductor substrate where a ground substrate can be peeled without taking a labor hour and to provide the group III nitride semiconductor substrate produced by the method. <P>SOLUTION: A method for producing a self-supported substrate comprises (i) a step to form an aluminum carbide layer 11 on the ground substrate 10, (ii) a step to nitride the aluminum carbide layer 11, (iii) a step to epitaxially grow a group III nitride semiconductor layer on a nitrided aluminum carbide layer 12 and (iv) a step to remove the ground substrate 10 from the group III nitride semiconductor layer and then prepare the group III nitride semiconductor substrate including the group III nitride semiconductor layer. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008120670(A) 申请公布日期 2008.05.29
申请号 JP20070158815 申请日期 2007.06.15
申请人 FURUKAWA CO LTD 发明人 SUNAKAWA HARUO;ISHIHARA YUJIRO;WASHIMI NORIHIKO;YAMAMOTO KAZUTOMI
分类号 C30B29/38;C23C16/01;H01L33/32;H01S5/323 主分类号 C30B29/38
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