| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device made of a chip which exhibits wafer reinforcement effects during a manufacturing process, is excellent in handleability, exhibits stable mounting characteristics during a mounting process, and exhibits high reliability with excellent heat dissipation of an element during actual use. SOLUTION: The semiconductor device is characterized by that a polybenzoazole film with a thickness of 1.5-125μm laminated via an adhesive layer with a thickness of 1-40μm on at least one of surfaces of a semiconductor wafer having a functional element formed on at least one of its surfaces. COPYRIGHT: (C)2008,JPO&INPIT
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