| 摘要 |
PROBLEM TO BE SOLVED: To make each of ruggedness parts function effectively as a heat-dissipating fin, when using a resin-sealed semiconductor device by assembling it to a printed circuit board, or the like, of an inverter and that of a power supply device. SOLUTION: When using a resin-encapsulated semiconductor power module by mounting it on a printed circuit board 5 of an inverter, or the like, the ruggedness parts 3 formed on the surface of a resin package 2 are installed facing the printed circuit board 5, while putting them into an attitude such that the ruggedness parts 3 face the flow of cooled air generated by natural convection or forced ventilation, in parallel with the flow. COPYRIGHT: (C)2008,JPO&INPIT
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