| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module capable of strengthening ground while contriving miniaturization. SOLUTION: The multi-chip module 1 is provided with electronic components 4 mounted on a surface 2a, a module substrate 2 comprising a shielding rid 5 attached to the surface 2a so as to cover the electronic components 4 and a module substrate 3 comprising the other electronic components 6 mounted on a surface 3a. In this case, the module substrates 2, 3 are laminated so that the surface 2a of the module substrate 2 and the rear surface 3b of the module substrate 3 are opposed to each other and a connecting land 10 electrically connected to the shielding rid 5 is formed on the rear surface 3b of the module substrate 3. COPYRIGHT: (C)2008,JPO&INPIT
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