| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To dismount a wafer from a spinner table by preventing the adhesion of a pawl to a frame even when the frame has been fixed via the pawl by a centrifugal force caused by the rotation of the spinner table in the case of coating a protective film on the surface of the wafer held by the frame via a tape. <P>SOLUTION: A resin coating apparatus comprises a frame holding means 41 which is arranged on the outer circumferential portion of the spinner table 40, and is configured such that the frame F is held by the pawls 502 connected to a weight portions 500 via arms 501 by swiveling the weight portions 500 toward the outer circumferential side by the centrifugal force caused by the rotation of the spinner table 40, wherein the arms 501 and the pawls 502 are connected by connecting portions 503 made of elastic material. When the rotation of the spinner table 40 is stopped, the connecting portions 503 moves the pawls 502, and the held state is released. As a result, the wafer can be dismounted from the spinner table 40 together with the frame F. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
