| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg that can improve adhesion between prepregs without need of a low-molecular weight component to be additionally added for enhancing the fluidity of the resin and in a wide controllable range of the fluidity and also can improve the solder heat resistance in the case of a resin system highly filled with an inorganic filler, to provide a laminate comprising the prepreg and to provide a process for producing the laminate. SOLUTION: The prepreg is produced by impregnating a reinforcing material with a resin and has through-holes. The laminate is formed by laying two or more plies of prepreg comprising the reinforcing material and the resin one upon another, superposing a metal foil on one side or both sides of the multi-laid prepregs and applying heat and pressure wherein the prepreg has through-holes in the thickness direction of the reinforcing material and the through-holes are filled with the resin. COPYRIGHT: (C)2008,JPO&INPIT
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