| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a photosensitive resin composition in which forming of an interlayer dielectric is relatively easy, and the formed interlayer dielectric excels in heat resistance property and resolution property, and a silica based coating using the composition. <P>SOLUTION: The photosensitive resin composition contains (a) component: a siloxane resin obtained by hydrolyzing and condensing a silane compound containing a compound expressed by a general expression (1), (b) component: fine particles, (c) component: naphthoquinone diazido sulphonic acid, and (d) component: a solvent in which the (a) component dissolves. In the expression (1), R<SP>1</SP>, A, and X show an organic group, a bivalent organic group, and a hydrolyzable group, respectively. A plurality of Xs in the same molecule may be the same or different from each other. <P>COPYRIGHT: (C)2008,JPO&INPIT |
