发明名称 CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide: a conductive pattern forming film for forming a conductive pattern on a flexible general plastic substrate by a simple process and for easily forming the conductive pattern by using an apparatus that performs a simple process of pressurization of grain orientating at a low temperature; a conductive pattern forming method for the same; and a conductive pattern forming apparatus for the same. <P>SOLUTION: The conductive pattern forming film is provided by arranging on the flexible film substrate a pattern that is formed by applying pressure while heating a conductive paste applied by diffusion of a powdery material or fine particles of a metal or a semiconductor. The conductive pattern forming apparatus is composed of a sample arranging table having a flat placing surface, and a pressurizing driving body movably arranged to the placing surface by facing the surface. The pressurizing driving body has a supporting base composed of a metal flat plate having a metal spherical body on the lower surface. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008124446(A) 申请公布日期 2008.05.29
申请号 JP20070268168 申请日期 2007.10.15
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL &amp, TECHNOLOGY 发明人 KAMATA SHUNEI;YOSHIDA MANABU
分类号 H05K3/10;G03F7/20;H01L21/027;H01L23/12;H05K1/03;H05K1/09 主分类号 H05K3/10
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