发明名称 |
CONDUCTIVE PATTERN FORMING FILM, AND CONDUCTIVE PATTERN FORMING METHOD AND CONDUCTIVE PATTERN FORMING APPARATUS FOR THE CONDUCTIVE PATTERN FORMING FILM |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: a conductive pattern forming film for forming a conductive pattern on a flexible general plastic substrate by a simple process and for easily forming the conductive pattern by using an apparatus that performs a simple process of pressurization of grain orientating at a low temperature; a conductive pattern forming method for the same; and a conductive pattern forming apparatus for the same. <P>SOLUTION: The conductive pattern forming film is provided by arranging on the flexible film substrate a pattern that is formed by applying pressure while heating a conductive paste applied by diffusion of a powdery material or fine particles of a metal or a semiconductor. The conductive pattern forming apparatus is composed of a sample arranging table having a flat placing surface, and a pressurizing driving body movably arranged to the placing surface by facing the surface. The pressurizing driving body has a supporting base composed of a metal flat plate having a metal spherical body on the lower surface. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008124446(A) |
申请公布日期 |
2008.05.29 |
申请号 |
JP20070268168 |
申请日期 |
2007.10.15 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL &, TECHNOLOGY |
发明人 |
KAMATA SHUNEI;YOSHIDA MANABU |
分类号 |
H05K3/10;G03F7/20;H01L21/027;H01L23/12;H05K1/03;H05K1/09 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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