| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in molding properties, reliability, laser marking properties and electric characteristics, generating no defects in electric characteristics caused by carbon black, which is a conductive material, even in thin, multi-pinned, long-wired or narrow-pad-pitched electronic devices, and to provide an electronic component device using the same. SOLUTION: The epoxy resin composition comprises an epoxy resin (A), a curing agent (B), and carbon black (C) having a screening residue of carbon black on the 25μm sieve of not greater than 3 ppm. COPYRIGHT: (C)2008,JPO&INPIT |
