发明名称 PACKAGING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a packaging structure capable of packaging an electronic component without using any complicated tools. SOLUTION: The packaging structure has: a housing 5a; the electronic components 12, 14 mounted to the housing 5a; and a wiring board 18 having a through hole for inserting pin-shaped terminals 12a, 14a erected from the electronic components 12, 14. A packaging auxiliary member 20 fixed to the housing 5a with the wiring board 18 is provided between the housing 5a and the wiring board 18. In the packaging auxiliary member 20, the through holes 20a, 20b regulating the direction of the pin-shaped terminals 12a, 14a include inclined guide surfaces 22a, 22b for guiding the tips of the pin-like terminals 12a, 14a to the through holes 20a, 20b. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008124062(A) 申请公布日期 2008.05.29
申请号 JP20060302833 申请日期 2006.11.08
申请人 AISIN SEIKI CO LTD 发明人 OKUYA HISAYOSHI
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
主权项
地址