发明名称 MANUFACTURING METHOD OF SILICON CRYSTAL AND MANUFACTURING METHOD OF SILICON WAFER
摘要 <p><P>PROBLEM TO BE SOLVED: To precisely measure the nitrogen concentration in a silicon crystal by simple and quick infrared ray absorption difference spectrum, without requiring separate references for a manufacturing method of a silicon crystal, and to provide a manufacturing method of silicon wafer. <P>SOLUTION: After a silicon crystal containing nitrogen is produced by the Czochralski method, the silicon crystal is made to reach a quasi-thermal equilibrium state at first heating temperature and a first infrared ray absorption spectrum of the silicon crystal is measured. Then, the silicon crystal is made to reach a quasi-thermal equilibrium at second heating temperature, and a second infrared ray absorption spectrum of the silicon crystal is measured; the infrared ray absorption difference spectrum between the first infrared ray absorption spectrum and the second infrared ray absorption spectra is obtained; next, the intensity of an absorption peak corresponding to a defect caused by nitrogen is obtained; and nitrogen concentration in the silicon crystal is obtained, based on the obtained intensities of absorption peaks. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008122413(A) 申请公布日期 2008.05.29
申请号 JP20080002751 申请日期 2008.01.10
申请人 FUJITSU LTD 发明人 TANAHASHI KATSUTO;KANEDA HIROSHI
分类号 C30B29/06;G01N21/35;G01N21/3504 主分类号 C30B29/06
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