发明名称 METHOD FOR ASSEMBLY OF WAFER PROBE
摘要 PROBLEM TO BE SOLVED: To provide a method for an assembly of many contact points type probe which is easy configuration in order to perform a high-frequency test of an integrated circuit or other microelectronics elements. SOLUTION: The probe assembly method includes (a) the process of forming a supporting member 14, (b) the process of preparing one-assembly consisting of a plurality of contact fingers 16 and the supporting members 14 in which the plurality of contact fingers 16 are maintained with a predetermined arrangement with the supporting tab 26 at the non-supporting state by the supporting part 14, (c) the process of attaching the plurality of the contact fingers 16 to the supporting part 14, and (d) the process of removing the supporting tab 26. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008122403(A) 申请公布日期 2008.05.29
申请号 JP20070330626 申请日期 2007.12.21
申请人 CASCADE MICROTECH INC 发明人 HAYDEN LEONARD;MARTIN JOHN;ANDREWS MIKE
分类号 G01R1/073;G01R31/26;G01R1/06;H01L21/66 主分类号 G01R1/073
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