| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder which makes it possible to perform highly accurate bonding work and supply high quality products, and to provide a die bonding method. SOLUTION: A chip is picked up at a pickup position by a collet 21, the collet 21 is carried to a mounting position, and the chip 22 is bonded at the mounting position. The collet 21 is provided with a camera recognition route 28 constituted of a transmissive member, and the chip 22 in the state of being picked up is observed in a camera 27 for recognition through the camera recognition route 28. COPYRIGHT: (C)2008,JPO&INPIT
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