| 摘要 |
PROBLEM TO BE SOLVED: To provide a shape recognition method for a semiconductor chip that precisely recognizes the shape of a semiconductor chip, and a method for adjusting the position and angle of the semiconductor chip collectively by use of the shape recognition method. SOLUTION: By placing a semiconductor chip 101 on a stage having an xy rectangular coordinate planar surface, scanning more than one virtual line 401 in parallel to an x-axis in the xy rectangular coordinate planar surface and so that the y coordinate values may increase, and using multiple intersections 420, 421 and 422 of these multiple virtual lines 401 and the semiconductor chip 101's perimeter, the shape of the semiconductor chip 101 can be recognized. This enables the angle and position of the semiconductor chip 101 to be collectively adjusted. This method has a very high correction accuracy, has fewer steps compared to conventional correction methods, and can easily correct the angle and position of the semiconductor chip 101. Thus, the rate of defective products at the bonding time can be decreased. COPYRIGHT: (C)2008,JPO&INPIT
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